Lead the forefront of optical and microelectronic process solutions at Advanced Microsystems Technologies. This senior role demands deep expertise in flip-chip and wire bonding, with a focus on hands-on innovation.
At AMT, a division of Sanmina Corporation, you'll guide the process architecture for advanced products in RF and optical components. Collaborate with R&D; and manufacturing teams to define comprehensive assembly strategies and ensure alignment with device physics. Your technical leadership will bridge initial concepts to full-scale production, making a significant impact on emerging technologies.
Key Responsibilities: - Define assembly strategies for complex optoelectronic modules - Lead development of process recipes, including flip-chip and wire bonding - Research,



procure, and oversee capital equipment testing - Provide DFx guidance to optimize yield and reliability - Serve as technical liaison during development, translating requirements
Requirements: - Master's Degree in Engineering fields - Minimum 8 years of microelectronics packaging experience - Expertise in flip-chip and wire bonding processes - Robust material science knowledge - Proficient in automated assembly equipment programming
Shape the future of connectivity and make your mark with AMT in Kanata, ON.#J-18808-Ljbffr

📌 Microelectronics Process Engineer At Amt Riviere Des Prairies—pointe Aux Trembles (Riviere-des-Prairies—Pointe-aux-Trembles)
🏢 Sanmina
📍 Riviere-des-Prairies—Pointe-aux-Trembles