Ic Packaging Design Intern: High-Speed Pcb & 3d Layout (Riviere-des-Prairies—Pointe-aux-Trembles)

Ic Packaging Design Intern: High-Speed Pcb & 3d Layout (Riviere-des-Prairies—Pointe-aux-Trembles)

03 Oct
|
Sierra Wireless
|
Riviere-des-Prairies—Pointe-aux-Trembles

03 Oct

Sierra Wireless

Riviere-des-Prairies—Pointe-aux-Trembles

Semtech Canada is offering a 12–16 month IC packaging design internship in Ottawa, starting May 2027. The role involves designing IC chip carriers and supporting high-density, high-speed transmission layouts under the SIP group.You will work with senior engineers, gain hands-on CAD design experience with Allegro/AutoCAD/SolidWorks, and learn to apply signal integrity concepts in a collaborative team setting.

📌 Ic Packaging Design Intern: High-Speed Pcb & 3d Layout (Riviere-des-Prairies—Pointe-aux-Trembles)
🏢 Sierra Wireless
📍 Riviere-des-Prairies—Pointe-aux-Trembles

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