Lead the forefront of optical and microelectronic process solutions at Advanced Microsystems Technologies. This senior role demands deep expertise in flip-chip and wire bonding, with a focus on hands-on innovation.

At AMT, a division of Sanmina Corporation, you'll guide the process architecture for advanced products in RF and optical components. Collaborate with R&D; and manufacturing teams to define comprehensive assembly strategies and ensure alignment with device physics. Your technical leadership will bridge initial concepts to full-scale production, making a significant impact on emerging technologies.

Key Responsibilities:
• Define assembly strategies for complex optoelectronic modules
• Lead development of process recipes, including flip-chip and wire bonding
• Research, procure,



and oversee capital equipment testing
• Provide DFx guidance to optimize yield and reliability
• Serve as technical liaison during development, translating requirements

Requirements:
• Master's Degree in Engineering fields
• Minimum 8 years of microelectronics packaging experience
• Expertise in flip-chip and wire bonding processes
• Robust material science knowledge
• Proficient in automated assembly equipment programming

Shape the future of connectivity and make your mark with AMT in Kanata, ON.
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📌 Microelectronics Process Engineer at AMT (Quebec City)
🏢 Sanmina
📍 Quebec City