Advance your engineering career with Sheba Microsystems as a full time Packaging Process Engineer in Toronto, ON. Drive the development of cutting-edge MEMS packaging and assembly processes.Sheba Microsystems is looking for a dedicated Packaging Process Engineer to support the scaling of advanced MEMS-based products. The role involves optimizing Chip-on-Board (COB) processes and characterizing precision assembly for high-performance camera modules.



You will engage in root cause analysis and process validation while collaborating with various engineering teams for continuous improvement.Key Responsibilities:Develop and evaluate MEMS packages and camera modulesOptimize Chip-on-Board precision packaging processesInvestigate packaging and assembly failures systematicallyApply quality tools for process improvement and validationOperate lab equipment and test MEMS devicesRequirements:Bachelor's degree in Mechanical or Manufacturing Engineering2+ years in process engineering or semiconductor packagingHands-on experience with Chip-on-Board processesSkills in structured root cause analysis and corrective actionsFamiliarity with 3D CAD software like SolidWorksUtilize your engineering expertise to drive innovation in MEMS packaging at Sheba Microsystems.

📌 Full-Time Packaging Process Engineer Toronto
🏢 Sheba Microsystems
📍 Toronto