Lead the forefront of optical and microelectronic process solutions at Advanced Microsystems Technologies. This senior role demands deep expertise in flip-chip and wire bonding, with a focus on hands-on innovation.

At AMT, a division of Sanmina Corporation, you'll guide the process architecture for advanced products in RF and optical components. Collaborate with R&D; and manufacturing teams to define comprehensive assembly strategies and ensure alignment with device physics. Your technical leadership will bridge initial concepts to full-scale production, making a significant impact on emerging technologies.

Key Responsibilities: • Define assembly strategies for complex optoelectronic modules • Lead development of process recipes, including flip-chip and wire bonding • Research,



procure, and oversee capital equipment testing • Provide DFx guidance to optimize yield and reliability • Serve as technical liaison during development, translating requirements

Requirements: • Master's Degree in Engineering fields • Minimum 8 years of microelectronics packaging experience • Expertise in flip-chip and wire bonding processes • Robust material science knowledge • Proficient in automated assembly equipment programming

Shape the future of connectivity and make your mark with AMT in Kanata, ON.

📌 Microelectronics Process Engineer at AMT (Ahuntsic)
🏢 Sanmina
📍 Ahuntsic