Lead the forefront of optical and microelectronic process solutions at Advanced Microsystems Technologies. This senior role demands deep expertise in flip-chip and wire bonding, with a focus on hands-on innovation. At AMT, a division of Sanmina Corporation, you'll guide the process architecture for advanced products in RF and optical components.

Collaborate with R&D; and manufacturing teams to define comprehensive assembly strategies and ensure alignment with device physics. Your technical leadership will bridge initial concepts to full-scale production, making a significant impact on emerging technologies. Key Responsibilities:

- Define assembly strategies for complex optoelectronic modules
- Lead development of process recipes, including flip-chip and wire bonding




- Research, procure, and oversee capital equipment testing
- Provide DFx guidance to optimize yield and reliability
- Serve as technical liaison during development, translating requirements

Requirements:

- Master's Degree in Engineering fields
- Minimum 8 years of microelectronics packaging experience
- Expertise in flip-chip and wire bonding processes
- Robust material science knowledge
- Proficient in automated assembly equipment programming

Shape the future of connectivity and make your mark with AMT in Kanata, ON.

📌 Microelectronics Process Engineer at AMT (Ottawa)
🏢 Sanmina
📍 Ottawa