Xanadu’s mission is to build quantum computers that are useful and available to people everywhere. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. We are looking for a highly motivated and experienced Senior Packaging New Product Introduction (NPI) Engineer to join our dedicated engineering team.

In this pivotal role, you will lead the successful introduction of new packaging processes and technologies from concept to mass production. This involves collaborating with R&D;, design, manufacturing, and supply chain teams across the entire product lifecycle to ensure robust, scalable, and ultra-low-loss packaging solutions.

New Process Development & Implementation: Lead the development, validation, and implementation of new packaging processes and equipment, from initial concept through pilot production to high-volume manufacturing. Hands‑on conduct comprehensive process characterization, optimization, and validation for new packaging lines and equipment. Research, evaluate, select, and qualify new packaging equipment and materials, staying current with industry trends and advancements.

Troubleshooting & Problem Solving: Act as a subject matter expert in hands‑on troubleshooting complex packaging process issues during NPI phases and provide ongoing production support.

Project Management: Manage multiple NPI projects concurrently,



ensuring timely delivery and strict adherence to all technical specifications. Master's degree in Mechanical Engineering, Electrical and Electronic Engineering, Photonics Engineering, Packaging Engineering, Materials Science, or a related technical field. Minimum of 5+ years of progressive experience in packaging engineering, with a strong emphasis on new product introduction (NPI) within a manufacturing environment.

Proven experience with various packaging technologies and equipment; Excellent analytical and problem‑solving skills, with a data‑driven approach to decision‑making. Demonstrated ability to manage complex technical projects from conception to completion. Proficiency with CAD software (e.g., SolidWorks, AutoCAD) and statistical analysis tools.

Proven experience using advanced die‑to‑carrier, die‑to‑die, and die‑to‑wafer bonding techniques.

Experience with automation and robotics in packaging. The base salary range is 160,000 - 200,000+ CAD. You will also be eligible for equity and benefits. They are fundamental and lay the foundation for culture at Xanadu.

We are committed to building an inclusive, protected, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier‑free workplace. Please be advised that we may use artificial intelligence (AI) tools to assist in the screening and assessment of applicants for this position.

If you would like more information about how your data is processed, please contact us. #

📌 Photonic Packaging Senior Engineer H/F (Toronto)
🏢 Xanadu
📍 Toronto