Advance your engineering career with Sheba Microsystems as a full time Packaging Process Engineer in Toronto, ON. Drive the development of cutting-edge MEMS packaging and assembly processes.

Sheba

Microsystems is looking for a dedicated Packaging Process Engineer to support the scaling of advanced MEMS-based products. The role involves optimizing Chip-on-Board (COB) processes and characterizing precision assembly for high-performance camera modules. You will engage in root cause analysis and process validation while collaborating with various engineering teams for continuous improvement. Key Responsibilities:

- Develop and evaluate MEMS packages and camera modules
- Optimize Chip-on-Board precision packaging processes




- Investigate packaging and assembly failures systematically
- Apply quality tools for process improvement and validation
- Operate lab equipment and test MEMS devices Requirements:
- Bachelor’s degree in Mechanical or Manufacturing Engineering
- 2+ years in process engineering or semiconductor packaging
- Hands-on experience with Chip-on-Board processes
- Skills in structured root cause analysis and corrective actions
- Familiarity with 3D CAD software like SolidWorks Utilize your engineering expertise to drive innovation in MEMS packaging at Sheba Microsystems.

📌 Full-Time Packaging Process Engineer Toronto
🏢 Sheba Microsystems
📍 Toronto