Advance your engineering career with Sheba Microsystems as a full time Packaging Process Engineer in Toronto, ON. Drive the development of cutting-edge MEMS packaging and assembly processes.

Sheba Microsystems is looking for a dedicated Packaging Process Engineer to support the scaling of advanced MEMS-based products. The role involves optimizing Chip-on-Board (COB) processes and characterizing precision assembly for high-performance camera modules. You will engage in root cause analysis and process validation while collaborating with various engineering teams for continuous improvement.

Key Responsibilities:
• Develop and evaluate MEMS packages and camera modules
• Optimize Chip-on-Board precision packaging processes
• Investigate packaging and assembly failures systematically




• Apply quality tools for process improvement and validation
• Operate lab equipment and test MEMS devices

Requirements:
• Bachelor’s degree in Mechanical or Manufacturing Engineering
• 2+ years in process engineering or semiconductor packaging
• Hands-on experience with Chip-on-Board processes
• Skills in structured root cause analysis and corrective actions
• Familiarity with 3D CAD software like SolidWorks

Utilize your engineering expertise to drive innovation in MEMS packaging at Sheba Microsystems.
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📌 Full-Time Packaging Process Engineer Toronto (Ontario)
🏢 Sheba Microsystems
📍 Ontario