Ic Packaging Design Intern: High Speed Pcb & 3d Layout Montreal

30 Sep

Sierra Wireless

Montreal

30 Sep

Sierra Wireless

Montreal

Semtech Canada is offering a 12–16 month IC packaging design internship in Ottawa, starting May 2027. The role involves designing IC chip carriers and supporting high-density, high-speed transmission layouts under the SIP group.

You will work with senior engineers, gain hands-on CAD design experience with Allegro/AutoCAD/SolidWorks, and learn to apply signal integrity concepts in a team-oriented team workplace.

📌 Ic Packaging Design Intern: High Speed Pcb & 3d Layout Montreal
🏢 Sierra Wireless
📍 Montreal

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