Ic Packaging Design Intern: High Speed Pcb & 3d Layout Quebec City (Canada)

Ic Packaging Design Intern: High Speed Pcb & 3d Layout Quebec City (Canada)

29 Sep
|
Sierra Wireless
|
Canada

29 Sep

Sierra Wireless

Canada

Semtech Canada is offering a 12–16 month IC packaging design internship in Ottawa, starting May 2027. The role involves designing IC chip carriers and supporting high-density, high-speed transmission layouts under the SIP group.
You will work with senior engineers, gain hands-on CAD design experience with Allegro/AutoCAD/SolidWorks, and learn to apply signal integrity concepts in a team-oriented team workplace.
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📌 Ic Packaging Design Intern: High Speed Pcb & 3d Layout Quebec City (Canada)
🏢 Sierra Wireless
📍 Canada

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