IC Packaging Design Intern: High-Speed PCB & 3D Layout (Montreal)

IC Packaging Design Intern: High-Speed PCB & 3D Layout (Montreal)

28 Sep
|
Sierra Wireless
|
Montreal

28 Sep

Sierra Wireless

Montreal

Semtech Canada is offering a 12–16 month IC packaging design internship in Ottawa, starting May 2027. The role involves designing IC chip carriers and supporting high-density, high-speed transmission layouts under the SIP group. You will work with senior engineers, gain hands-on CAD design experience with Allegro/AutoCAD/SolidWorks, and learn to apply signal integrity concepts in a collaborative team setting.

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📌 IC Packaging Design Intern: High-Speed PCB & 3D Layout (Montreal)
🏢 Sierra Wireless
📍 Montreal

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