Job Summary:

ON Semiconductor is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Waterloo, Ontario N2V 1KB, Canada. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.

Performance Objectives:
Do thermal-mech simulation for microelectronic packaging and system, assembly process such as Ag sintering and Cu sintering
Analyze existing packages of reliability issues that are induced by thermal problems.
Do analysis and correlation of thermal mech modeling results to measured data
Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy
Setup and maintain the HW/SW setting for thermal modeling
Provide support to other thermal mech modeling users in the company
Innovation of new technology through simulation
Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm,



crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models

Requirements:
Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials
Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process
Knowledge and experience of CAD concepts and Solidworks
Familiar with semiconductor packaging
Familiar with material thermal mech properties
Robust knowledge of problem analysis and diagnosis technique
Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination
Familiar with package test and analysis, quality assurance, and reliability methods
Ability to perform model correlation to empirical measurement
Familiar with the Unix/Linux operating system
Familiar with FEA software ANSYS Mechanical APDL/Work Bench
Strong English communication capability
Solid learning capability

📌 Semiconductor Packaging Modeling And Simulation Engineer London
🏢 Socket.dev
📍 London