Become a vital part of ON Semiconductor’s R & D modeling and simulation team in Waterloo, Ontario, as a Semiconductor Packaging Modeling and Simulation Engineer.

Your role will center around driving recent technology innovations through thermal simulations. This position offers the chance to develop new product designs and enhance assembly processes through extensive modeling work. You will utilize your knowledge of thermal-mechanical behavior and contribute to reliability analysis, impacting global customers. Team collaboration will be essential as you maintain high standards in semiconductor packaging. Key Responsibilities:

- Perform simulations for microelectronic thermal-mechanical behavior
- Analyze and diagnose reliability-inducing thermal issues




- Correlate simulation outcomes with empirical data
- Innovate simulation techniques using AI and probability algorithms
- Assist in setting up modeling hardware/software environments Requirements:
- Master or PhD in Physics or Mechanical Engineering
- Proficient in thermal modeling and mechanical properties
- Experienced with CAD tools like Solidworks
- Familiar with FEA software and semiconductor processes
- Strong analytical problem-solving capabilities Help shape the future of semiconductor packaging at ON Semiconductor.

📌 Thermal Simulation Engineer at ON Semiconductor (Toronto)
🏢 Socket.dev
📍 Toronto