Xanadu in Toronto is seeking a Packaging Engineer to join the Hardware group's Packaging Team. You will implement and optimize high-precision die bonding processes and support lab operations across photonic and micro-electronic assemblies for our rack-scale quantum hardware. You will work under senior engineers, contribute to process improvements, and maintain daily lab duties while ensuring quality and safety in a fast-paced research workplace.
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📌 Packaging Engineer: Die Bonding for Quantum Hardware (Winnipeg)
🏢 Xanadu
📍 Winnipeg
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