Packaging Engineer: Die Bonding for Quantum Hardware (Ontario)

Packaging Engineer: Die Bonding for Quantum Hardware (Ontario)

22 Sep
|
Xanadu
|
Ontario

22 Sep

Xanadu

Ontario

Xanadu in Toronto is seeking a Packaging Engineer to join the Hardware group's Packaging Team. You will implement and optimize high-precision die bonding processes and support lab operations across photonic and micro-electronic assemblies for our rack-scale quantum hardware.
You will work under senior engineers, contribute to process improvements, and maintain daily lab duties while ensuring quality and safety in a quick-paced research environment.

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📌 Packaging Engineer: Die Bonding for Quantum Hardware (Ontario)
🏢 Xanadu
📍 Ontario

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