Xanadu in Toronto, Canada, is seeking a Packaging Engineer to join the Hardware group. You will operate, optimize, and improve high-precision die bonding processes and equipment, contributing to Xanadu’s rack-scale quantum computer development and maintaining lab readiness.
Under guidance from senior engineers, you will perform sample builds, assist with photonic and micro-electronic assemblies, and apply hands-on device integration expertise to advance our quantum hardware program.
#J-18808-Ljbffr
📌 Die Bonding Packaging Engineer for Quantum Hardware (Ontario)
🏢 Xanadu
📍 Ontario
Reply to this offer
Impress this employer describing Your skills and abilities, fill out the form below and leave Your personal touch in the presentation letter.