19 Sep
|
Microchip Technology
|
Toronto
19 Sep
Microchip Technology
Toronto
Seeking an Intermediate Package Development Engineer to manage IC package development, from design to qualification. Responsibilities include collaborating with business units, identifying package options, performing simulations, and overseeing recent materials and processes.
📌 Senior Engineer I - Packaging - $86,000 - $186,000 A Year (Toronto)
🏢 Microchip Technology
📍 Toronto