Drive innovation in integrated circuit design as a 3rd Party IP Technical Lead at AMD. This hybrid role focuses on high-speed PHY and mixed-signal IP across AMD products. The candidate will collaborate with a team of experts in high-speed physical interface technology, integrating and supporting third-party memory and SerDes PHY IP.

This leadership position involves all phases of product lifecycle management, from architecture through to production, and requires close partnerships with vendors and internal teams. Key Responsibilities:

- Lead technical ownership of third-party Memory/Serdes PHY IP
- Provide product lifecycle leadership from architecture to validation
- Collaborate with vendors for IP evaluation and integration




- Ensure quality in SoC integration across all designs
- Drive architectural decisions balancing performance and cost Requirements:
- Strong design experience in high-speed mixed-signal IP
- Familiarity with SerDes and Memory PHY architectures preferred
- Knowledge of interface protocols like PCIe, USB, and more
- Experience with FinFET technologies at 7nm or less
- Basic understanding of digital circuits and programming skills Bring technical expertise in high-speed design and collaboration to advance AMD's creative product lines.

📌 3rd Party IP Technical Lead at AMD (Markham)
🏢 AMD
📍 Markham