10 Sep
|
Global Talent Alliance, Canada
|
Quebec City
10 Sep
Global Talent Alliance, Canada
Quebec City
Global Talent Alliance seeks a Microelectronic Packaging Design Engineer to join our Design Engineering team in Ottawa. You will lead the design of microelectronic modules and packaging concepts from concept through volume manufacturing, collaborating with electrical, RF, optical and mechanical engineers.
The role requires a solid background in wafer-level and chip-scale packaging, solid CAD skills (AutoCAD, SolidWorks) and experience with Cadence Allegro, plus familiarity with FEA tools for
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📌 Senior Microelectronic Packaging Engineer RF/Optical Modules (Quebec City)
🏢 Global Talent Alliance, Canada
📍 Quebec City