- Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
- Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
- Establish validation plans and characterize optical performance under relevant operating conditions
- Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
- Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies, including Design for Manufacturability, Design for Test, and Design for Reliability
- Develop assembly stations integrating precision motion, optical metrology, and environmental control
- Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability
- Collaborate across teams to develop robust, manufacturable packaging solutions
- Define qualification criteria and acceptance standards to support product release

Requirements

- PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline
- Knowledge of and hands-on-experience with integrated photonics and optics
- 3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
- Working experience in new product introduction
- Excellent teamwork, interpersonal and written communication skills
- Good organization and problem solving skills
- Strong attention to detail
- Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits




- Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
- Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
- Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)
- Cover letter with resume in one file

Core Competencies

Demonstrates expertise in developing and implementing optical packaging processes for integrated photonic devices, with a strong focus on high-precision optical alignment and data-driven process optimization. Proven ability to collaborate across teams and apply Design for Excellence methodologies to ensure robust, manufacturable solutions.

Highest-signal resume keywords

- PhD Or Master’s Degree In Physics
- Integrated Photonics And Optics
- High-Precision Optical Alignment
- Data-Driven Process Optimization
- Recent Product Introduction (NPI)

Hard Skills

- Optical Packaging Processes
- Alignment Methods And Tooling
- Optical Performance Characterization
- Process Controls And SOPs
- Photonic Integrated Circuit Design
- Semiconductor Packaging Design
- Optoelectronic Packaging
- Fiber Optic Packaging
- Data Analysis For Yield Improvement
- Design For Excellence (DfX) Methodologies

Soft Skills

- Teamwork
- Interpersonal Communication
- Written Communication
- Organization
- Problem Solving
- Attention To Detail

Industry Keywords

- Photonic Integrated Circuits
- Packaging Engineering
- Design For Manufacturability (DfM)
- Design For Test (DfT)
- Design For Reliability (DfR)

Tools & Technologies

- Precision Motion Systems
- Optical Metrology
- Environmental Control Systems

📌 Optical Packaging - Assembly Engineer (Coquitlam)
🏢 Jobtailor
📍 Coquitlam