At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives.

Help turn “possibility” into “reality” by leading the design execution of next-generation Data Center GPU and MI programs. This role represents a critical leadership position responsible for delivering high-performance, high-complexity package designs in a fast-paced setting. You will drive operational excellence, scale execution using automation and AI-enabled methodologies, and deliver best-in-class package solutions that meet aggressive timelines and technical requirements.

Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met. Establish and maintain robust execution frameworks, including milestone tracking, risk management, and readiness gates. Interface with senior leadership to provide clear program status, risks, and mitigation strategies.

Lead, mentor, and grow a high-performing team of package design engineers across geographies. Foster a culture of accountability, innovation, and continuous improvement aligned with AMD engineering excellence. Conduct performance reviews, talent development planning, and succession management.





TECHNICAL & CROSS-FUNCTIONAL LEADERSHIP Collaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence. PROCESS & METHODOLOGY INNOVATION Champion adoption of AI/ML-enabled tools and automation (layout optimization, design rule checking, predictive analytics) to improve productivity and decision-making. Scale digital transformation initiatives within the package design organization.

Experience in semiconductor package design, with strong focus on high-performance or data center products. Proven experience leading teams and executing multiple concurrent complex projects in fast-paced environments.

Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).

Experience working with OSATs, substrate vendors, and manufacturing partners.

Experience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration). S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.

We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. #

📌 Sr. Manager Packaging Engineering (Markham)
🏢 Advanced Micro Devices
📍 Markham