Elevate your career as an Advanced Packaging Process Analyst at TechInsights in Ottawa, ON. Leverage your expertise in semiconductor packaging with a focus on advanced materials and integration processes. In this role, you will contribute significantly to our Technology team by analyzing advanced packaging devices and trends. Ideal candidates have a minimum of 5 years in foundry or OSAT processes, with solid skills in hybrid bonding, TSV formation, and device structure analysis. You will be instrumental in building process flows, measuring critical dimensions, and supporting technical documentation efforts. Key Responsibilities:
Develop process flows for advanced packaging structures
Measure critical dimensions like TSVs and bump pitch




Write technical reports based on detailed analyses
Compare results generation over generation
Produce technical blogs and video briefings Requirements:
Bachelor’s or Master’s degree in relevant fields
5+ years of industry experience in advanced packaging
Proficiency in analytical methods (e.G., SEM, TEM)
Solid analytical and communication skills
Familiarity with silicon photonics is a plus Your expertise in advanced packaging will help TechInsights push the boundaries of semiconductor technology. #J-18808-Ljbffr

📌 Advanced Packaging Process Analyst At Techinsights Ottawa
🏢 Remote Genie
📍 Ottawa