Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
Establish validation plans and characterize optical performance under relevant operating conditions
Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies, including Design for Manufacturability, Design for Test, and Design for Reliability
Develop assembly stations integrating precision motion, optical metrology, and environmental control
Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability
Collaborate across teams to develop robust, manufacturable packaging solutions
Define qualification criteria and acceptance standards to support product release
Requirements PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline
Knowledge of and hands-on-experience with integrated photonics and optics
3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
Working experience in new product introduction
Excellent teamwork, interpersonal and written communication skills
Good organization and problem solving skills
Strong attention to detail
Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits




Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)
Cover letter with resume in one file
Core Competencies Demonstrates expertise in developing and implementing optical packaging processes for integrated photonic devices, with a robust focus on high-precision optical alignment and data-driven process optimization. Proven ability to collaborate across teams and apply Design for Excellence methodologies to ensure robust, manufacturable solutions.
Highest-signal resume keywords PhD Or Master’s Degree In Physics
Integrated Photonics And Optics
High-Precision Optical Alignment
Data-Driven Process Optimization
New Product Introduction (NPI)
Hard Skills Optical Packaging Processes
Alignment Methods And Tooling
Optical Performance Characterization
Process Controls And SOPs
Photonic Integrated Circuit Design
Semiconductor Packaging Design
Optoelectronic Packaging
Fiber Optic Packaging
Data Analysis For Yield Improvement
Design For Excellence (DfX) Methodologies
Soft Skills Teamwork
Interpersonal Communication
Written Communication
Organization
Problem Solving
Attention To Detail
Industry Keywords Photonic Integrated Circuits
Packaging Engineering
Design For Manufacturability (DfM)
Design For Test (DfT)
Design For Reliability (DfR)
Tools & Technologies Precision Motion Systems
Optical Metrology
Environmental Control Systems

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📌 Optical Packaging – Assembly Engineer (British Columbia)
🏢 Jobtailor
📍 British Columbia