Join TechInsights as an Advanced Packaging Analyst and make a difference in semiconductor technology. Based in Ottawa, you’ll analyze advanced packaging processes and contribute to creative projects. As a key member of our Technology team, you will bring your extensive experience in semiconductor processes to support major client initiatives.
With a solid background in hybrid bonding and flip chip assembly, you will build process flows, measure critical dimensions, and create technical documentation. A collaborative mindset is critical as you will work across teams to monitor sector trends. Key Responsibilities:
- Create process flows for packaging structures and integration schemes
- Measure features like interposer layers and bump pitches
- Publish reports on analyses and results
- Track technological advancements in the industry
- Prepare technical content for blogs and briefings
Requirements:
- Degree in Physics, Electrical Engineering, or related
- Over 5 years in advanced semiconductor packaging
- Experience with SEM, TEM, and other methods
- Excellent communication and presentation skills
- Knowledge of wafer testing is beneficial
Utilize your advanced packaging skills at TechInsights in Ottawa and help drive industry breakthroughs.