Join TechInsights as an Advanced Packaging Analyst and make a difference in semiconductor technology. Based in Ottawa, you’ll analyze advanced packaging processes and contribute to cutting-edge projects.

As a key member of our Technology team, you will bring your extensive experience in semiconductor processes to support major client initiatives. With a solid background in hybrid bonding and flip chip assembly, you will build process flows, measure critical dimensions, and create technical documentation. A collaborative mindset is critical as you will work across teams to monitor sector trends.

Key Responsibilities:
• Create process flows for packaging structures and integration schemes
• Measure features like interposer layers and bump pitches




• Publish reports on analyses and results
• Track technological advancements in the industry
• Prepare technical content for blogs and briefings

Requirements:
• Degree in Physics, Electrical Engineering, or related
• Over 5 years in advanced semiconductor packaging
• Experience with SEM, TEM, and other methods
• Excellent communication and presentation skills
• Knowledge of wafer testing is beneficial

Utilize your advanced packaging skills at TechInsights in Ottawa and help drive industry breakthroughs.
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📌 TechInsights Advanced Packaging Analyst Role (Quebec City)
🏢 Remote Genie
📍 Quebec City