Shape the future of optical technology with Ranovus as a Principal Advanced Optical Packaging Engineer in Ottawa, Ontario. This full-time role focuses on creative packaging technologies for AI-driven optical engines.

As a key player at Ranovus, you will drive the development of packaging and assembly strategies for advanced optical devices. You'll engage with cross-disciplinary teams, focusing on flip-chip assembly, laser integration, and fiber attachment. Your expertise in optical, mechanical, and thermal aspects will be essential as you manage processes from development through production.

Key Responsibilities:
• Develop packaging architecture and assembly strategies
• Lead flip-chip and die attachment process development




• Oversee laser packaging and hybrid integration processes
• Define fiber attach and optical I/O strategies
• Manage NPI and manufacturing transfer processes

Requirements:
• 10+ years in photonic or optoelectronic packaging
• Hands-on experience with flip-chip bonding and assembly
• Strong understanding of optical and mechanical interactions
• Knowledge of soldering and encapsulation processes
• Effective communication and technical judgment skills

Be part of transforming optical technologies in a team-oriented workplace at Ranovus.
J-18808-Ljbffr

📌 Principal Optical Packaging Engineer Ottawa Quebec City (Canada)
🏢 RANOVUS
📍 Canada