Shape the future of optical technology with Ranovus as a Principal Advanced Optical Packaging Engineer in Ottawa, Ontario. This full time role focuses on innovative packaging technologies for AI-driven optical engines.
As a key player at Ranovus, you will drive the development of packaging and assembly strategies for advanced optical devices. You'll engage with cross-disciplinary teams, focusing on flip-chip assembly, laser integration, and fiber attachment. Your expertise in optical, mechanical, and thermal aspects will be essential as you manage processes from development through production.
Key Responsibilities:



- Develop packaging architecture and assembly strategies - Lead flip-chip and die attachment process development - Oversee laser packaging and hybrid integration processes - Define fiber attach and optical I/O strategies - Manage NPI and manufacturing transfer processes
Requirements: - 10+ years in photonic or optoelectronic packaging - Hands-on experience with flip-chip bonding and assembly - Solid understanding of optical and mechanical interactions - Knowledge of soldering and encapsulation processes - Effective communication and technical judgment skills
Be part of transforming optical technologies in a cooperative setting at Ranovus.#J-18808-Ljbffr

📌 Principal Optical Packaging Engineer Ottawa Riviere Des Prairies—pointe Aux Trembles (Canada)
🏢 RANOVUS
📍 Canada