Elevate your career as an Advanced Packaging Process Analyst at TechInsights in Ottawa, ON. Leverage your expertise in semiconductor packaging with a focus on advanced materials and integration processes.

In this role, you will contribute significantly to our Technology team by analyzing advanced packaging devices and trends. Ideal candidates have a minimum of 5 years in foundry or OSAT processes, with strong skills in hybrid bonding, TSV formation, and device structure analysis. You will be instrumental in building process flows, measuring critical dimensions, and supporting technical documentation efforts.

Key Responsibilities:



• Develop process flows for advanced packaging structures • Measure critical dimensions like TSVs and bump pitch • Write technical reports based on detailed analyses • Compare results generation over generation • Produce technical blogs and video briefings

Requirements: • Bachelor’s or Master’s degree in relevant fields • 5+ years of industry experience in advanced packaging • Proficiency in analytical methods (e.g., SEM, TEM) • Robust analytical and communication skills • Familiarity with silicon photonics is a plus

Your expertise in advanced packaging will help TechInsights push the boundaries of semiconductor technology. #J-18808-Ljbffr

📌 Advanced Packaging Process Analyst at TechInsights (Montreal)
🏢 Remote Genie
📍 Montreal