Shape the future of optical technology with Ranovus as a Principal Advanced Optical Packaging Engineer in Ottawa, Ontario. This full-time role focuses on innovative packaging technologies for AI-driven optical engines. As a key player at Ranovus, you will drive the development of packaging and assembly strategies for advanced optical devices.
You'll engage with cross-disciplinary teams, focusing on flip-chip assembly, laser integration, and fiber attachment. Your expertise in optical, mechanical, and thermal aspects will be essential as you manage processes from development through production. Key Responsibilities:
- Develop packaging architecture and assembly strategies
- Lead flip-chip and die attachment process development
- Oversee laser packaging and hybrid integration processes
- Define fiber attach and optical I/O strategies
- Manage NPI and manufacturing transfer processes Requirements:
- 10+ years in photonic or optoelectronic packaging
- Hands-on experience with flip-chip bonding and assembly
- Strong understanding of optical and mechanical interactions
- Knowledge of soldering and encapsulation processes
- Effective communication and technical judgment skills Be part of transforming optical technologies in a collaborative setting at Ranovus.