Principal Advanced Optical Packaging Engineer Location: Ottawa, Ontario | Type: Full time Ranovus is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity. This hands-on role covers package/process architecture, flip-chip and BGA assembly, hybrid laser integration, fiber attach, optical alignment, thermal-mechanical risk management, burn-in, tooling, automation, and manufacturing transfer. Working directly with design teams, equipment developers, suppliers, CMs, and OSAT partners.

Package & Process Architecture: Translate product requirements into packaging/assembly strategies; define build sequences, inspection points, rework, and test gates; identify risks and drive DOEs/qualification. Flip-Chip, Die Attach & Electrical Integration: define reflow, solder paste, flux, and cleaning approaches; define AOI, X-ray, and cross-section inspection methods.

Laser Packaging &

• Hybrid Integration: Lead hybrid laser-to-carrier and laser-to-ePIC assembly process development; define alignment, attachment, and burn-in/test flows; define alignment strategy, adhesive/cure processes, and loss-control methods

• Thermal-Mechanical &

• Materials: select and qualify solders, underfills, adhesives, TIMs, and encapsulants; partner with mechanical/simulation specialists. define tooling, SOPs, PFMEAs, and control plans; decide what stays in-house vs. 10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.



~ Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes. ~ Strong grasp of how optical, mechanical, thermal, electrical, material, and manufacturing requirements interact in an optoelectronic package. ~ Practical knowledge of soldering, wetting, flux, intermetallics, surface finishes, underfill, adhesives, curing, and contamination control. ~ Experience with DOEs, process characterization, qualification builds, and failure analysis. ~ Experience defining process windows, inspection criteria, and manufacturing controls. ~ Ability to distinguish lab demonstrations from robust, transferable manufacturing processes. ~ Strong technical judgment and communication skills. Single-mode edge coupling, lensed coupling, mode-field conversion, isolators, turning optics. Laser characterization, chip-on-carrier test, burn-in, reliability qualification. motion control, machine vision, force sensing, UV curing. Thermal-mechanical modeling (warpage, stress, CTE, solder-joint reliability). CAD experience (SolidWorks or comparable). Bachelor's in Mechanical, Materials, Electrical Engineering, Physics, Optics, Photonics, Packaging Engineering, or related field required

• Master's/PhD preferred. Comfortable moving between architecture-level and hands-on assembly discussions, and capable of bringing the right specialists together to reach engineering decisions. #

📌 Principal Advanced Optical Packaging Engineer (Canada)
🏢 RANOVUS
📍 Canada