Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Boucherville)

Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Boucherville)

28 Aug
|
Sanmina-SCI Systems de México
|
Boucherville

28 Aug

Sanmina-SCI Systems de México

Boucherville

Lead process architecture and development for optical and microelectronic solutions, requiring expertise in flip-chip and wire bonding.

📌 Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Boucherville)
🏢 Sanmina-SCI Systems de México
📍 Boucherville

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