Become the Advanced Packaging Lead at Untether AI, where your expertise will influence AI product development through creative packaging solutions. Collaborate creatively to enhance reliability and performance. As the Advanced Packaging Lead at Untether AI, you will interact with engineers and internal teams to craft packaging strategies that support advanced AI products.
The role further involves proposal management for supplier partnerships and addressing technical challenges in packaging. Successful candidates will guide long-term technical decisions and boost internal capabilities. Key Responsibilities:
Innovate advanced packaging solutions for AI technologies
Collaborate with internal stakeholders on improvements
Drive decisions regarding chiplet strategies and interfaces
Manage external supplier collaborations for solutions
Lead quality assurance and design integrity assessments
Requirements:
Expertise in 2.5/3D packaging technologies
Familiarity with chiplets and interconnect designs
Background in packaging manufacturing processes
Skilled in design tools and failure analysis
Achievements in advanced technology node designs
Join Untether AI to empower the next generation of AI products with your advanced packaging expertise.
📌 Advanced Packaging Lead Needed At Untether Ai Toronto
🏢 Untether Ai
📍 Toronto
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