Advance your career as the Packaging Technology Lead at Lightmatter, where innovation meets AI data center solutions. This hybrid role emphasizes cutting-edge packaging technologies and reliability assessments.As a pivotal member of the Packaging Technology team, you will focus on developing packaging processes that set the standard for performance in the industry. Your collaboration with various teams will involve refining assembly techniques and managing test chips that inform next-generation AI architectures.



Help ensure that Lightmatter's products deliver both high reliability and exceptional compute power.Key Responsibilities:Create comprehensive packaging and assembly test processesDevelop architectures that adhere to stringent product performance criteriaOversee the definition and design of test chipsGenerate validated design rules for assembly processesPerform reliability analyses for product improvementRequirements:MS or PhD in Mechanical Engineering or equivalentExpertise in wafer scale packaging assemblyKnowledge of materials and equipment for packaging technologiesExperience with photonics packaging methodsStrong analytical and communication skillsContribute to Lightmatter's mission in the AI revolution while developing your skills in advanced packaging technologies.#J-18808-Ljbffr

📌 Packaging Technology Lead At Lightmatter (Toronto)
🏢 Lightmatter
📍 Toronto