Join Lightmatter as the Lead Integrator for Package Assembly Technologies and influence the advancement of AI infrastructure. This hybrid role focuses on cutting-edge packaging and assembly processes.

In this exciting position, you'll spearhead the integration of assembly processes for next-gen AI architectures. Collaborate with design teams, foundries, and OSAT partners to ensure high-yield production techniques and compliance with rigorous performance metrics. Your efforts will directly impact Lightmatter's mission to deliver unmatched compute power for AI and high-performance computing.

Key Responsibilities:



• Direct the development of 3D package assembly and testing strategies • Innovate package designs optimizing for manufacturability and reliability • Lead test chip design and requirements definition • Validate design rules to ensure assembly process efficiency • Conduct analysis to mitigate reliability risks in products

Requirements: • MS or PhD in Mechanical Engineering, Material Science, or related • Experience with wafer scale packaging assembly processes • Familiarity with photonics packaging requirements • Proven project management and problem-solving abilities • Robust communication skills for stakeholder engagement

Lead the charge in revolutionary packaging technologies at Lightmatter and shape the future of computing. #J-18808-Ljbffr

📌 Lead Integrator For Package Assembly Technologies Winnipeg (Canada)
🏢 lightmatter
📍 Canada