Advance your career as the Packaging Technology Lead at Lightmatter, where innovation meets AI data center solutions. This hybrid role emphasizes cutting-edge packaging technologies and reliability assessments.

As a pivotal member of the Packaging Technology team, you will focus on developing packaging processes that set the standard for performance in the industry. Your collaboration with various teams will involve refining assembly techniques and managing test chips that inform next-generation AI architectures. Help ensure that Lightmatter’s products deliver both high reliability and exceptional compute power.

Key Responsibilities:
• Create comprehensive packaging and assembly test processes
• Develop architectures that adhere to stringent product performance criteria




• Oversee the definition and design of test chips
• Generate validated design rules for assembly processes
• Perform reliability analyses for product improvement

Requirements:
• MS or PhD in Mechanical Engineering or equivalent
• Expertise in wafer scale packaging assembly
• Knowledge of materials and equipment for packaging technologies
• Experience with photonics packaging methods
• Solid analytical and communication skills

Contribute to Lightmatter’s mission in the AI revolution while developing your skills in advanced packaging technologies.
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📌 Packaging Technology Lead at Lightmatter (Ontario)
🏢 Lightmatter
📍 Ontario