Transform the future of photonics as an Advanced Packaging Engineer. Develop next-generation solutions for complex photonic integrated circuits in a agile team setting. As a Packaging Engineer specializing in PIC technology, you will design and develop optimized packaging and integration solutions for photonic devices.

Collaborating closely with various engineering disciplines, you will tackle challenges related to optical alignment, thermal management, and mechanical reliability. This role allows you to influence the complete lifecycle of photonic products, from development through manufacturing. Key Responsibilities:
Innovate packaging architectures for photonic circuits
Optimize die bonding and fibre coupling processes




Collaborate on device performance and manufacturability
Support prototype and product scaling efforts
Analyze and resolve packaging and yield challenges Requirements:
Degree in Photonics, Electrical, or Mechanical Engineering
Experience with advanced photonic packaging methods
Familiarity with precision assembly techniques
Background in microelectronics processes beneficial
Solid analytical and problem-solving skills Join a team where your expertise will drive the advancement of photonic technology and system reliability.

📌 Advanced Photonic Packaging Engineer Role Vancouver
🏢 Darwin Recruitment
📍 Vancouver