Join Lightmatter as the Lead Integrator for Package Assembly Technologies and influence the advancement of AI infrastructure. This hybrid role focuses on innovative packaging and assembly processes.

In this exciting position, you'll spearhead the integration of assembly processes for next-gen AI architectures. Collaborate with design teams, foundries, and OSAT partners to ensure high-yield production techniques and compliance with rigorous performance metrics. Your efforts will directly impact Lightmatter's mission to deliver unmatched compute power for AI and high-performance computing.

Key Responsibilities:



• Direct the development of 3D package assembly and testing strategies • Innovate package designs optimizing for manufacturability and reliability • Lead test chip design and requirements definition • Validate design rules to ensure assembly process efficiency • Conduct analysis to mitigate reliability risks in products

Requirements: • MS or PhD in Mechanical Engineering, Material Science, or related • Experience with wafer scale packaging assembly processes • Familiarity with photonics packaging requirements • Proven project management and problem-solving abilities • Robust communication skills for stakeholder engagement

Lead the charge in revolutionary packaging technologies at Lightmatter and shape the future of computing. #J-18808-Ljbffr

📌 Lead Integrator for Package Assembly Technologies (Winnipeg)
🏢 Lightmatter
📍 Winnipeg