21 Aug
|
Microchip Technology
|
Toronto
21 Aug
Microchip Technology
Toronto
Seeking an Intermediate Package Development Engineer to manage IC package development, from design to qualification. Responsibilities include collaborating with business units, identifying package options, performing simulations, and overseeing current materials and processes.
📌 Senior Engineer I - Packaging - $86,000 - $186,000 A Year (Toronto)
🏢 Microchip Technology
📍 Toronto