Elevate your engineering career as a Lead Package Assembly Specialist at Lightmatter, shaping the future of AI data centers. This hybrid position focuses on packaging technologies and assembly processes.As a crucial part of the Packaging Technology team, lead the development of cutting-edge packaging solutions that redefine compute performance in extreme-scale data centers. You will collaborate closely with design teams and external partners to craft high-yield assembly processes and ensure product reliability.



Your expertise will contribute to advanced package designs aimed at powering next-generation AI and HPC workloads.Key Responsibilities:Develop end-to-end 3D package assembly and test processesExecute package architectures that meet performance and reliability standardsDefine requirements and manage test chip design processesCreate and validate assembly process design rulesAnalyze reliability risks to enhance product integrityRequirements:MS or PhD in Mechanical Engineering or related fieldExperience in wafer scale packaging assembly developmentKnowledge of 2D/3D packaging technologiesUnderstanding of photonics packaging requirementsStrong project management and communication skillsShape the future of data centers while working on cutting-edge technologies at Lightmatter.#J-18808-Ljbffr

📌 Lead Package Assembly Specialist At Lightmatter (Toronto)
🏢 Lightmatter
📍 Toronto