Shape the future of computing as an Advanced Packaging CAD Engineer with AMD in Markham, ON. Dive into 3D stack generation and AI capabilities in design automation.
Join AMD's dynamic team focusing on 3D-IC design and automation workflows. This role emphasizes collaboration with global teams, applying machine learning to CAD and EDA practices. Bring your knowledge of advanced packaging technologies and EDA toolchains into impactful projects.
Key Responsibilities:
Maintain 3D-IC design flows from RTL to signoff
Develop AI-enhanced CAD automation solutions
Automate verification tasks using agentic systems
Work with EDA vendors to improve design strategies
Evaluate methodologies to enhance quality of results
Requirements:
Solid background in 3D-IC design
Familiarity with EDA tools like Synopsys and Cadence
Hands-on experience in AI applications for design
Solid scripting skills in a Linux/Unix setting
Bachelor's or Master's in Electrical Engineering
Utilize your skills to optimize design processes at AMD and lead creative projects!
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