At AMD, our mission is to build excellent products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. The 3D-IC Design and SoC Construction CAD team delivers automated environments for industry-leading 3D stack generation and validation. Our flows encompass design element creation, port assignment and pattern generation, tile optimization, clock and power distribution, high-performance bus implementation, and timing budgeting.

We evaluate, procure, and deploy technologies from leading EDA vendors within a unified flow framework — and increasingly, we embed AI-driven capabilities at every stage of the stack, from silicon to system. You will collaborate directly with the global CAD organization and project teams to understand design requirements and deliver innovative solutions that combine EDA tools, custom in-house capabilities, and end-to-end AI integration. The ideal candidate brings a strong silicon hardware design background, software and scripting proficiency, and hands‑on experience applying machine learning to CAD or EDA workflows.

You have a passion for modern, complex processor architecture, digital design, and the automation that makes it scale. You are energized by the intersection of AI and CAD — whether that means applying ML models to improve QoR, building LLM‑assisted flows, or designing agentic systems that reduce manual iteration. You are a team player with excellent communication skills, comfortable collaborating across sites and time zones, and eager to take on hard, open-ended problems.

Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.



Develop and integrate end‑to‑end AI capabilities into CAD flows — including ML‑based optimization, predictive modeling, and LLM‑assisted automation. Partner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, best practices, and AI co‑development opportunities.

Regress methodology, analyze results, and develop capabilities that measurably improve quality of results. Work closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: Timing, Area, and Performance. Strong experience in 3D-IC design and advanced packaging technologies.

Demonstrated experience applying AI to CAD, EDA, or hardware design problems.

Experience building or working with LLM‑based tools, agentic AI frameworks, or AI‑assisted automation pipelines. Strong scripting skills in Python, TCL, and Perl in a Linux/Unix environment.

ACADEMIC CREDENTIALS: Bachelors or Masters degree in computer engineering/Electrical Engineering AMD and its subsidiaries are equal‑opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.

AMD’s “Responsible AI Policy” is available here.

📌 3D IC and ADVANCED PACKAGING CAD ENGINEER (Markham)
🏢 AMD
📍 Markham