Shape the future of computing as an Advanced Packaging CAD Engineer with AMD in Markham, ON. Dive into 3D stack generation and AI capabilities in design automation.
Join AMD's dynamic team focusing on 3D-IC design and automation workflows. This role emphasizes collaboration with global teams, applying machine learning to CAD and EDA practices. Bring your knowledge of advanced packaging technologies and EDA toolchains into impactful projects.
Key Responsibilities:
- Maintain 3D-IC design flows from RTL to signoff
- Develop AI-enhanced CAD automation solutions
- Automate verification tasks using agentic systems
- Work with EDA vendors to improve design strategies
- Evaluate methodologies to enhance quality of results
Requirements:
- Strong background in 3D-IC design
- Familiarity with EDA tools like Synopsys and Cadence
- Hands-on experience in AI applications for design
- Solid scripting skills in a Linux/Unix environment
- Bachelor's or Master's in Electrical Engineering
Utilize your skills to optimize design processes at AMD and lead cutting-edge projects!