Elevate your engineering career as a Lead Package Assembly Specialist at Lightmatter, shaping the future of AI data centers. This hybrid position focuses on packaging technologies and assembly processes.

As a crucial part of the Packaging Technology team, lead the development of cutting-edge packaging solutions that redefine compute performance in extreme-scale data centers. You will collaborate closely with design teams and external partners to craft high-yield assembly processes and ensure product reliability. Your expertise will contribute to advanced package designs aimed at powering next-generation AI and HPC workloads.

Key Responsibilities:
• Develop end-to-end 3D package assembly and test processes
• Execute package architectures that meet performance and reliability standards




• Define requirements and manage test chip design processes
• Create and validate assembly process design rules
• Analyze reliability risks to enhance product integrity

Requirements:
• MS or PhD in Mechanical Engineering or related field
• Experience in wafer scale packaging assembly development
• Knowledge of 2D/3D packaging technologies
• Understanding of photonics packaging requirements
• Strong project management and communication skills

Shape the future of data centers while working on cutting-edge technologies at Lightmatter.
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📌 Lead Package Assembly Specialist at Lightmatter (Ontario)
🏢 Lightmatter
📍 Ontario