Transform the future of photonics as an Advanced Packaging Engineer. Develop next-generation solutions for complex photonic integrated circuits in a agile team environment.

As a Packaging Engineer specializing in PIC technology, you will design and develop optimized packaging and integration solutions for photonic devices. Collaborating closely with various engineering disciplines, you will tackle challenges related to optical alignment, thermal management, and mechanical reliability. This role allows you to influence the complete lifecycle of photonic products, from development through manufacturing.

Key Responsibilities:
• Innovate packaging architectures for photonic circuits
• Optimize die bonding and fibre coupling processes




• Collaborate on device performance and manufacturability
• Support prototype and product scaling efforts
• Analyze and resolve packaging and yield challenges

Requirements:
• Degree in Photonics, Electrical, or Mechanical Engineering
• Experience with advanced photonic packaging methods
• Familiarity with precision assembly techniques
• Background in microelectronics processes beneficial
• Strong analytical and problem-solving skills

Join a team where your expertise will drive the advancement of photonic technology and system reliability.
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📌 Advanced Photonic Packaging Engineer Role (British Columbia)
🏢 Darwin Recruitment
📍 British Columbia