Accelerate next-gen technology with AMD as a 3D IC Design Engineer in Markham, ON. Utilize cutting-edge tools to implement advanced packaging flows and AI-driven optimizations.
This role within AMD’s CAD team requires robust expertise in 3D-IC design. Collaborate with global design teams to innovate solutions integrating EDA tools and AI capabilities. Expect to work closely with hardware design elements and software scripting to achieve high-performance outcomes.
Key Responsibilities:
Implement advanced design flows from RTL through signoff
Integrate AI functionality into CAD processes
Deploy AI systems that automate design workflows
Collaborate with EDA vendors on feature requirements
Define strategies to meet future design needs
Requirements:
Background in 3D-IC and packaging technologies
Experience with Synopsys 3DIC Compiler tools
Knowledge of EDA tools by Synopsys and Cadence
Proficiency in Python, TCL, and Perl scripting
Relevant degree in Computer or Electrical Engineering
Drive innovation in AI and CAD to shape the future at AMD in Markham!
J-18808-Ljbffr
📌 3d Ic Design Engineer At Amd Markham
🏢 AMD
📍 Markham
Reply to this offer
Impress this employer describing Your skills and abilities, fill out the form below and leave Your personal touch in the presentation letter.