Accelerate next-gen technology with AMD as a 3D IC Design Engineer in Markham, ON. Utilize cutting-edge tools to implement advanced packaging flows and AI-driven optimizations.

This role within AMD’s CAD team requires solid expertise in 3D-IC design. Collaborate with global design teams to innovate solutions integrating EDA tools and AI capabilities. Expect to work closely with hardware design elements and software scripting to achieve high-performance outcomes.

Key Responsibilities: • Implement advanced design flows from RTL through signoff • Integrate AI functionality into CAD processes • Deploy AI systems that automate design workflows • Collaborate with EDA vendors on feature requirements • Define strategies to meet future design needs

Requirements: • Background in 3D-IC and packaging technologies • Experience with Synopsys 3DIC Compiler tools • Knowledge of EDA tools by Synopsys and Cadence • Proficiency in Python, TCL, and Perl scripting • Relevant degree in Computer or Electrical Engineering

Drive innovation in AI and CAD to shape the future at AMD in Markham! #J-18808-Ljbffr

📌 3D IC Design Engineer at AMD (Markham)
🏢 AMD
📍 Markham