Accelerate next-gen technology with AMD as a 3D IC Design Engineer in Markham, ON. Utilize cutting-edge tools to implement advanced packaging flows and AI-driven optimizations.
This role within AMD’s CAD team requires robust expertise in 3D-IC design. Collaborate with global design teams to innovate solutions integrating EDA tools and AI capabilities. Expect to work closely with hardware design elements and software scripting to achieve high-performance outcomes.
Key Responsibilities:
- Implement advanced design flows from RTL through signoff
- Integrate AI functionality into CAD processes
- Deploy AI systems that automate design workflows
- Collaborate with EDA vendors on feature requirements
- Define strategies to meet future design needs
Requirements:
- Background in 3D-IC and packaging technologies
- Experience with Synopsys 3DIC Compiler tools
- Knowledge of EDA tools by Synopsys and Cadence
- Proficiency in Python, TCL, and Perl scripting
- Relevant degree in Computer or Electrical Engineering
Drive innovation in AI and CAD to shape the future at AMD in Markham!
#J-18808-Ljbffr
📌 3D IC Design Engineer at AMD (Markham)
🏢 AMD
📍 Markham