Accelerate next-gen technology with AMD as a 3D IC Design Engineer in Markham, ON. Utilize cutting-edge tools to implement advanced packaging flows and AI-driven optimizations.

This role within AMD’s CAD team requires solid expertise in 3D-IC design. Collaborate with global design teams to innovate solutions integrating EDA tools and AI capabilities. Expect to work closely with hardware design elements and software scripting to achieve high-performance outcomes.

Key Responsibilities:
• Implement advanced design flows from RTL through signoff
• Integrate AI functionality into CAD processes
• Deploy AI systems that automate design workflows
• Collaborate with EDA vendors on feature requirements
• Define strategies to meet future design needs

Requirements:
• Background in 3D-IC and packaging technologies
• Experience with Synopsys 3DIC Compiler tools
• Knowledge of EDA tools by Synopsys and Cadence
• Proficiency in Python, TCL, and Perl scripting
• Relevant degree in Computer or Electrical Engineering

Drive innovation in AI and CAD to shape the future at AMD in Markham!
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📌 3D IC Design Engineer at AMD (Ontario)
🏢 AMD
📍 Ontario