icspi is building the future of nanoscale imaging.

We’ve revolutionized atomic force microscopy (AFM) by miniaturizing it by a factor of 1,000,000x compared to traditional systems: integrating all the components of an AFM onto a single CMOS chip, which we call microAFM.

Our core tech is field-proven and used by scientists and engineers in over 40 countries.

Now we are using our core tech to solve throughput-resolution gaps in the semiconductor industry: catching nanoscale defects to enable recent processes and prolong Moore's Law.

Today, scanning a wafer with AFM would take about 70 years. By using thousands of microAFMs in parallel, we can scan a wafer in a matter of hours.

To get an idea of what AFM is in one minute, watch this YouTube short that features our core tech: https://www.youtube.com/shorts/xKlqsv4nCao

About the role

As MEMS Manufacturing Engineer at icspi, you will work on manufacturing technology from CMOS to MEMS processing to packaging to enable entirely new nanoscale imaging technology.

We are looking for a knowledgeable and detail-oriented engineer with a broad skill set across microfabrication and packaging. You will play a critical role in working with our foundry and OSAT partners to develop, integrate and optimize manufacturing processes to scale our unique MEMS-based AFM technology to drive industry-leading performance and capability.

We are fabless and less than 10% of time is expected to be hands-on in the cleanroom. Work includes defining process requirements,



co-developing and reviewing proposals and DOEs, analyzing data and continuously improving yield and reliability.

The ideal candidate is a self-starter who uses first principles thinking, has hands-on experience in the cleanroom, and has managed suppliers (foundry and OSAT).

What you’ll do

- Own end-to-end process definition for our MEMS-based AFM devices and probe tips - from CMOS to MEMS processing to packaging
- Lead supplier engagement: define process requirements and specifications for our foundry and OSAT partners, co-develop DOEs and processes, execute on continuous improvement (yield and reliability)
- <10% hands-on in the cleanroom (packaging, metrology, microfabrication)
- Travel typically <10%, up to 25% during transfer/bring-up

Required experience

- Bachelor’s Degree or higher in engineering (chemical, materials, nanotechnology, mechanical, electrical or engineering physics), physics or material science
- 3+ years of experience in cleanroom (lithography, deposition, etch), strong understanding of end-to-end processing
- Hands-on experience with semiconductor packaging (wirebonding, wafer bonding, PCBs)
- Hands-on metrology experience (e.g., optical, SEM, interferometry)
- Strong analytical and problem-solving skills, with the ability to troubleshoot complex microfabrication issues remotely, diagnosing root cause from supplier data
- Demonstrated success with DOE and yield/failure analysis, ideally on a production process

📌 Semiconductor/MEMS Manufacturing Engineer (Kitchener)
🏢 Icspi
📍 Kitchener